Copper Clad Laminates Market Summary

The global copper clad laminates market size was estimated at USD 16.40 billion in 2023 and is projected to reach USD 26.34 billion by 2030, growing at a CAGR of 6.1% from 2024 to 2030. This steady expansion is primarily attributed to the rapid growth of the electronics industry, as copper clad laminates are a critical raw material used in the production of printed circuit boards. Furthermore, continuous advancements in technologies such as 5G networks and the Internet of Things are accelerating demand by enabling higher performance, miniaturization, and improved connectivity across electronic devices.

The increasing adoption of electronic components in the automotive industry, including advanced driver-assistance systems and autonomous driving technologies, is significantly contributing to the growth of copper clad laminates. These applications require reliable and high-performance materials to ensure safety and efficiency. Likewise, the rising use of copper clad laminates in medical devices such as wearable health monitoring systems and implantable devices supports enhanced reliability, precision, and long-term performance, further driving market demand.

Key Market Trends & Insights

• Asia Pacific copper clad laminates market dominated with a revenue share of more than 45% in 2023, driven by strong manufacturing presence, high electronics production, and growing investments in advanced technologies across the region.
• North America copper clad laminates market is expected to register significant growth during the forecast period, supported by technological innovation, increasing demand for advanced electronics, and expansion in automotive and healthcare applications.
• By laminate type, rigid segment accounted for the largest revenue share of 82.4% in 2023, owing to its widespread use in consumer electronics, industrial equipment, and automotive applications.
• By reinforcement material, glass fiber segment is expected to grow at the fastest CAGR over the forecast period due to its superior mechanical strength, thermal stability, and electrical insulation properties.
• By resin type, epoxy segment held the fastest CAGR in terms of revenue for the year 2023, as epoxy resins offer excellent adhesion, durability, and cost effectiveness for PCB manufacturing.

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Market Size & Forecast

• 2023 Market Size: USD 16.40 Billion
• 2030 Projected Market Size: USD 26.34 Billion
• CAGR (2024–2030): 6.1%
• Asia Pacific: Largest market in 2023

Key Companies & Market Share Insights

Some of the key players operating in market are AGC Inc.; ITEQ CORPORATION; Kblaminate; and Panasonic Holdings Corporation:

• AGC Inc. specializes in architectural glass, automotive, electronics, chemicals, life sciences, and ceramic sectors. The company has numerous manufacturing facilities and research centers with operations in over 30 countries around the world.
• ITEQ CORPORATION is engaged in the production of high-performance copper-clad laminate materials for printed circuit board (PCB) applications. The company serves, radio frequency and microwave devices (e.g. 5G and mmWaves), computational & communications applications (e.g. servers, storage, switches), high-density interconnect solutions (e.g. smartphones), and automotive applications (e.g. advanced driver assist systems).

NAN YA PLASTICS CORPORATION, Cipel Italia., and Taiwan Union Technology Corporation. are some of the emerging participants in copper clad laminates industry.

• NAN YA PLASTICS CORPORATION specializes in producing plastic products, chemicals, electronic material, fibers and textiles, machinery, and switchgear. The company caters to household appliances, outdoor sports, transport materials, building materials coatings, 3C appliances, civil farms, industrial equipment, and other applications.
• Taiwan Union Technology Corporation is a Taiwanese company that is engaged in the production and distribution of high frequency, extreme low loss, super low loss, very low loss, and low loss laminates; mid-loss materials; non-flow/ mid-flow prepreg; high thermal reliability; and standard loss materials.

Key Players

•  
• NAN YA PLASTICS CORPORATION
• Taiwan Union Technology Corporation.
• ITEQ CORPORATION
• AGC Inc.
• Rogers Corporation.
• Doosan Corporation.
• Isola Group
• Shandong JinBao Electric Co., Ltd.
• Dhan Laminates.
• Sytech Technology Co. Ltd.
• Panasonic Holdings Corporation
• Cipel Italia.

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Conclusion

The copper clad laminates market is set for steady expansion, supported by strong demand from electronics, automotive, and medical sectors worldwide. Continuous innovation in PCB design, rising adoption of advanced technologies, and increasing device complexity are reinforcing material requirements. Regional leadership of Asia Pacific, along with growing opportunities in North America, highlights a balanced global growth outlook. Dominance of rigid laminates, glass fiber reinforcement, and epoxy resins reflects industry preference for performance, durability, and cost efficiency. Overall, sustained technological progress and diversified end-use applications will continue to create long-term growth opportunities for copper clad laminates manufacturers and suppliers globally.