RF Interconnect Market To Witness Massive Growth By 2030

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RF Interconnect Market Summary

The global RF interconnect market size was valued at USD 33,002.6 million in 2024 and is projected to reach USD 51,640.3 million by 2030, growing at a CAGR of 7.9% from 2025 to 2030. This steady growth is driven by the widespread adoption of RF interconnect solutions across a broad range of industries, including telecommunications, aerospace, defense, medical devices, and satellite communications. The increasing need for reliable high-frequency signal transmission in advanced electronic systems continues to support market expansion.

The performance of RF interconnects is defined by key attributes such as low insertion loss, high shielding effectiveness, strong mechanical stability, and resistance to harsh environmental conditions. As frequency requirements increase with the global rollout of 5G networks and the development of next-generation communication technologies, the precision and efficiency of RF interconnects become increasingly critical. High-power and mission-critical applications often depend on custom-engineered interconnect solutions to ensure secure, accurate, and uninterrupted data transmission, further driving demand for advanced RF components.

Key Market Trends & Insights

  • Asia Pacific dominated the global RF interconnect industry with the largest revenue share of 44.4% in 2024. The region’s dominance is supported by rapid industrialization, strong growth in telecommunications infrastructure, and the presence of major electronics manufacturing hubs.
  • China led the Asia Pacific market and held the largest revenue share in 2024. China’s leadership is attributed to its extensive electronics manufacturing base, expanding 5G deployment, and rising investments in aerospace, defense, and industrial automation.
  • By type, RF cable assembly led the market, holding the largest revenue share of 32.7% in 2024. The dominance of this segment is driven by its widespread use in connecting RF components across communication, testing, and industrial systems.
  • By frequency, up to 50GHz segment held the dominant position in the market and accounted for the leading revenue share of 41.3% in 2024. This segment benefits from high demand in telecommunications, radar systems, and wireless infrastructure.
  • By end use, the industrial segment is expected to grow at the fastest CAGR of 9.1% from 2025 to 2030. The growth of industrial automation, smart factories, and connected machinery is fueling increased adoption of RF interconnect solutions in this segment.

Order a free sample PDF of the RF Interconnect Market Intelligence Study, published by Grand View Research.

Market Size & Forecast

  • 2024 Market Size: USD 33,002.6 Million
  • 2030 Projected Market Size: USD 51,640.3 Million
  • CAGR (2025-2030): 7.9%
  • Asia Pacific: Largest market in 2024

Key Companies & Market Share Insights

Key players operating in the RF interconnect market are undertaking various initiatives to strengthen their presence and increase the reach of their products and services. Strategies such as expansion activities and partnerships are key in propelling the market growth.

Key Players

  • Amphenol RF
  • Corning Incorporated
  • Flann Microwave Ltd.
  • HUBER+SUHNER
  • Radiall
  • Samtec
  • Rosenberger
  • Smith’s Interconnect
  • L. Gore & Associates, Inc.
  • ETL Systems Ltd

Explore Horizon Databook – The world's most expansive market intelligence platform developed by Grand View Research.

Conclusion

The RF interconnect market is poised for consistent growth driven by rising demand for high-frequency, high-performance connectivity across multiple industries. Expanding 5G infrastructure, increasing use of advanced communication systems, and growing industrial automation are key contributors to market expansion. Asia Pacific, led by China, remains a dominant region due to strong manufacturing capabilities and technology adoption. With RF cable assemblies and up to 50GHz frequency solutions leading demand, the market is expected to continue evolving to meet the needs of high-power and mission-critical applications worldwide.

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